TW_感測器研發_Packaging Development Engineer (MEMS products)
Core
Define and drive milestones for MEMS sensor packaging development, coordinate design and process engineering, and oversee sample build and qualification for automotive and consumer electronics applications.
Role type
Packaging Development Engineer (MEMS products)
Builds
Electronic MEMS sensors for automotive and consumer electronics
Domain
Semiconductor packaging and assembly
Deliverable
production ML models
Required skills
Milestone planning and risk mitigation, Semiconductor assembly technologies (LGA, BGA, DFN, WLCSP), Process optimization, Cross-functional collaboration, Project management, Multicultural teamwork
Preferred skills
English communication, Travel readiness
Technologies
LGA, BGA, DFN, WLCSP
Responsibilities
Establish package-development milestones, Coordinate package design and process development, Develop and optimize assembly processes, Oversee sample manufacturing and process qualification
Seniority
Mid-level, hands-on IC