【300mm】パワーデバイス開発エンジニア
Core
Developing 300mm power semiconductor devices for automotive and AI applications, covering device design, wafer process development, and mass production launch.
Role type
Senior IC semiconductor device engineer (300mm power devices)
Builds
High-voltage power semiconductor devices and manufacturing processes for automotive and AI chips
Domain
Semiconductor manufacturing (300mm wafer), Power electronics
Required skills
Semiconductor device structure design, Wafer process development, Semiconductor physics fundamentals, Wafer process prototyping, Cross-functional collaboration
Preferred skills
Wafer-level electrical characterization, TEG layout design
Technologies
300mm wafer fabrication, Device measurement and evaluation
Responsibilities
Establish 200mm to 300mm large-diameter technology, Develop wafer processes from concept to mass production, Design device structures and build wafer process flows, Conduct device measurement and evaluation, Collaborate with multiple departments on element process technology and quality assurance
Seniority
Senior, hands-on IC