Senior Engineer, PD SG, Dry Etch, NAND
Core
Developing next-generation NAND process technologies and optimizing dry etch recipes for 3D NAND devices.
Role type
Senior IC process development engineer (semiconductor manufacturing)
Builds
Production-worthy NAND memory technologies and process nodes
Domain
Semiconductor manufacturing / Memory storage / Dry Etch
Required skills
Dry etch process development, 3D NAND technology, Design of Experiments (DOE), statistics, data analysis, cross-functional collaboration, process troubleshooting, yield improvement, process simplification, AI-driven workflow optimization
Preferred skills
PhD in Material Science/Physics/Chemistry/EE, strong publication/patent record, experience with analysis software tools
Technologies
Dry Etch tools, 3D NAND, AI tools
Responsibilities
Rapid deployment of new NAND process technologies, define actions to achieve performance targets within timelines, examine and refine Dry Etch process windows and recipes, troubleshoot processes to drive yield and quality improvement, identify and own areas for improvement across Fabs, proactively find viable solutions with Fabs, drive process simplification initiatives, integrate best-known manufacturing methods into early development phases, leverage AI to streamline workflows and optimize processes
Seniority
Senior, hands-on IC