Sr. Assembly TD Engineer: Advance PKG stacking
Core
Senior engineer developing next-generation semiconductor packaging technologies, specifically flip chip, TCB, and hybrid bonding processes.
Role type
Senior IC advanced assembly technology development engineer
Builds
New packaging processes and DOE samples for high-volume production transfer
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Flip chip process development, TCB process development, hybrid bonding process development, DOE planning and execution, data analysis, process troubleshooting, process transfer documentation, FDC/SPC analysis
Preferred skills
Wet processing, surface cleaning, plasma surface activation, plasma-based dry etching, AI/automation tools application
Technologies
Flip chip, TCB, hybrid bonding, FDC, SPC
Responsibilities
Explore new semiconductor technologies (flip chip, TCB, hybrid bonding), set up and execute DOE plans, build samples and perform data analysis, lead troubleshooting to improve processes, prepare documentation for TD to HVM transfer, review process stability using FDC and SPC
Seniority
Senior, hands-on IC