Semiconductor Assembly Process Development Engineer
Core
Develop advanced semiconductor back-end packaging technologies (FCCSP, FCBGA) for AI, HPC, automotive, and IoT applications, focusing on high density, reliability, and thermal performance.
Role type
Semiconductor Assembly Process Development Engineer
Builds
High-density, high-heat-dissipation packages and high-reliability solutions for next-generation electronics
Domain
Semiconductor manufacturing, back-end processes, advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor back-end process development, assembly and packaging technology, material and process development, process improvement, quality control, equipment implementation, FCCSP, FCBGA, molding, strip grinding, package sawing
Preferred skills
AI/HPC package development, ISO/IATF quality standards experience
Technologies
FCCSP, FCBGA, FCLGA, molding, strip grinding, package sawing
Responsibilities
Development and evaluation of advanced packaging technologies, material and process development, improvement of assembly processes, support for production line setup and transition to mass production, driving process quality improvements and yield enhancement activities
Seniority
Mid-Senior, hands-on IC
