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Development engineer - Soldering technology - Footprint designer (maternity cover)

Budapest, hu🌐 Remote💼 Full-time🗓 2026-08-17 → 2026-09-26

Core

Design state-of-the-art solder joints (land patterns) considering manufacturing and lifetime aspects, with early involvement in product development.

Role type

Senior IC development engineer (soldering technology)

Builds

Solder joint land patterns for manufacturing

Domain

Automotive/Mechanical engineering + Soldering technology

Deliverable

product features

Required skills

3D design software proficiency, analytical thinking, problem-solving, precision in work

Preferred skills

German language skills, negotiation-level English

Technologies

3D design software

Responsibilities

Design land patterns for solder joints, support strategic topics, collaborate with cross-functional teams, solve manufacturing issues

Seniority

Senior, hands-on IC

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