Staff Package Development Engineer
Core
Develop, qualify, and industrialize semiconductor package solutions meeting performance, reliability, and cost requirements from concept to high-volume manufacturing.
Role type
Staff Package Development Engineer (Semiconductor)
Builds
Semiconductor packages (including advanced packaging like SiP, WLP, 2.5D/3D) for automotive, industrial, infrastructure, and IoT applications.
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor assembly processes (wafer backgrind, dicing, die attach, flip-chip, wire bonding, underfill, encapsulation, ball attach, singulation, SMT), DOE, statistical analysis, reliability testing, failure analysis, root-cause investigation, OSAT partner collaboration, project management
Preferred skills
Advanced packaging technologies (Flip-Chip CSP, System-in-Package, Fan-Out, Wafer-Level), thermal/mechanical/electrical characterization, automotive-grade qualification, sustainability initiatives, cost optimization
Technologies
Flip-Chip CSP, System-in-Package (SiP), Fan-Out Packaging (FOPLP/FOWLP), Wafer-Level Packaging (WLP/WLCSP), 2.5D/3D Packaging
Responsibilities
Develop and qualify semiconductor packages in collaboration with OSAT partners; Conduct package reliability testing, failure analysis, and root-cause investigations; Drive complex technology development activities in a global environment; Manage vendor and supplier relationships; Lead cross-functional teams from concept through high-volume manufacturing
Seniority
Staff, hands-on IC with strategic oversight
