TW_Senior Expert in "Classical Packaging Technologies-Wire Bonding" & Assembly Project Manager
Core
Senior expert in classical packaging technologies (wire bonding) and assembly project management for MEMS packaging projects.
Role type
Senior IC technical expert & Assembly Project Manager
Builds
MEMS packaging projects, engineering sample builds, and technology roadmaps
Domain
Semiconductor manufacturing / Micro-Electro-Mechanical Systems (MEMS) / Wire Bonding
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
wire bonding expertise, process standard definition, project planning and control, OSAT coordination, tooling procurement, risk management, technical roadmap development, stakeholder alignment
Preferred skills
mentoring and coaching, knowledge transfer, external network building, continuous improvement, structured problem-solving
Technologies
wire bonding, MEMS packaging, OSAT tools
Responsibilities
Define process standards and quality acceptance criteria, coordinate engineering sample builds and OSAT evaluation, manage project documentation and risks, drive technology solution decisions for roadmaps, conduct training and knowledge-transfer activities
Seniority
Senior, hands-on IC with mentorship responsibilities
