Wire Bond Process Engineer
Core
Own, characterize, and sustain the thermosonic wire bond process to deliver robust interconnect quality, high yields, and package reliability.
Role type
Process Engineer (Thermosonic Wire Bonding)
Builds
Semiconductor packages with Au/Al/Cu wire interconnects
Domain
Semiconductor manufacturing / Microelectronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thermosonic wire bonding, bond metallurgy, IMC formation, pad design, EFO tuning, loop engineering, SPC, DOE, MSA/GR&R, PFMEA, root cause analysis (5-Whys/Ishikawa), failure analysis (CSAM, X-ray, SEM)
Preferred skills
Cu wire or advanced interconnects experience
Technologies
K&S IConn, ASM Eagle, Shinkawa UTC
Responsibilities
Define and optimize wirebonding parameters and tooling effectiveness; troubleshoot critical wire bond losses (deformed bond, heel crack, cratering); manage bonders capability and preventive maintenance; qualify wires, capillaries, and pads; prepare evidence for customer audits (IATF/ISO); coach technicians on bond optimization and metrology
Seniority
Mid-level, hands-on IC