Semiconductor Assembly Process Development Engineer
Core
Developing high-density, high-heat-dissipation semiconductor packages (FCCSP, FCBGA) for AI/HPC, automotive, and IoT applications.
Role type
Semiconductor Assembly Process Development Engineer
Builds
Advanced packaging solutions for next-generation devices
Domain
Semiconductor manufacturing, back-end processes, packaging
Required skills
Semiconductor back-end process development, assembly and packaging technology, material and process development, process improvement, quality control, equipment implementation, FCCSP/FCBGA expertise, molding, strip grinding, package sawing
Preferred skills
AI/HPC package development, ISO/IATF quality standards experience
Technologies
FCCSP, FCBGA, FCLGA, molding, strip grinding, package sawing, ball mounting, marking, package sawing
Responsibilities
Development and evaluation of advanced packaging technologies, material and process development, improvement of assembly processes, support for production line setup and transition to mass production, driving process quality improvements and yield enhancement
Seniority
Mid-Senior, hands-on IC
