Sr Prcess Engineer工艺工程师
Core
Develop wire bonding (WB) processes for new semiconductor products and packages, driving NPI validation, yield improvement, and process stabilization.
Role type
Senior IC process engineer (wire bonding)
Builds
Semiconductor packages (e.g., QFP, BGA) using Cu/Au wire bonding
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
wire bonding process development, NPI workflow management, data analysis, SPC, troubleshooting, material introduction optimization, equipment/tooling configuration, MS Office proficiency
Preferred skills
semiconductor manufacturing experience (QFP, BGA), process engineering, equipment engineering
Technologies
Cu/Au wire bonding, QFP, BGA, SPC tools
Responsibilities
Establish process windows and bonding conditions independently, drive NPI activities covering validation and yield improvement, perform troubleshooting for process stabilization, manage new material introduction and optimize parameters, define and maintain WB process specifications and standard procedures, optimize equipment and tooling specifications
Seniority
Senior, hands-on IC
