半導体組立工程 技術開発エンジニア
Core
Developing next-generation semiconductor packaging technologies (Flip Chip, SiP) for AI/HPC, automotive, and IoT applications, focusing on high-density, high-reliability, and high-thermal-conductivity solutions.
Role type
Senior IC semiconductor assembly engineering (packaging/process development)
Builds
Advanced packaging solutions (FCCSP, FCBGA) and assembly processes for high-performance computing and automotive chips
Domain
Semiconductor manufacturing / Packaging engineering
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor back-end assembly/packaging development, Molding process development, Strip Grinding process development, PKG saw process development, Process improvement, Quality management, Equipment implementation
Preferred skills
AI/HPC packaging development, FCBGA/FCCSP/FCLGA development, ISO/IATF quality standards compliance
Technologies
FCCSP, FCBGA, FCLGA, Molding, Strip Grinding, Ball mount, Mark, PKG saw
Responsibilities
Develop and evaluate advanced packaging technologies (FCCSP, FCBGA), develop and improve assembly processes (Molding, Strip Grinding, Ball mount, Mark, PKG saw), support manufacturing line launch and mass production transition, improve process quality and yield
Seniority
Senior, hands-on IC
