芯片产品工程师（上海）
Core
Drive mass production ramp-up for chip products, managing packaging/test outsourcing strategies, engineering sample delivery, and yield improvement.
Role type
Senior IC chip product engineer (NPI & Yield)
Builds
Chip products (packaged and tested)
Domain
Semiconductor manufacturing (packaging, testing, NPI)
Required skills
NPI process management, yield analysis, statistical data analysis, failure analysis (SEM/X-Ray/EMMI/SAT), reliability testing (ESD/Latch-up/HTOL), tooling preparation, supply chain coordination
Preferred skills
2.5D/3D packaging experience, wafer fab experience
Technologies
SEM, X-Ray, EMMI, SAT, ESD, Latch-up, HTOL
Responsibilities
Coordinate packaging/test outsourcing strategies, prepare tooling for engineering samples, validate NPI processes, analyze yield data to identify and resolve key factors, troubleshoot production anomalies and implement corrective actions
Seniority
Mid-level, hands-on IC
