Chip Assembly Die Bonding Process Engineer (m/f/d) - 100%
Core
Develop and optimize die bonding, curing, marking, and inspection processes for semiconductor chip assembly to ensure yield, quality, and equipment reliability.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
High-volume semiconductor chips and advanced assembly equipment
Domain
Semiconductor manufacturing / Photonics
Required skills
Die bonding process development, root cause analysis, SPC, DoE, equipment troubleshooting, cleanroom operations, process documentation
Preferred skills
Lean Six Sigma, soldering processes, equipment software programming, supplier qualification
Technologies
Automated manufacturing equipment, cleanroom environment
Responsibilities
Own and improve chip assembly processes including die bonding and curing; Develop and qualify processes for new product designs; Analyze process performance and implement corrective actions; Collaborate with R&D to transfer technologies to manufacturing; Troubleshoot and maintain die-bonding equipment; Work in a cleanroom environment supporting production teams.
