Senior Staff Engineer Package Technology Development
Core
Lead technology risk assessments, package integration, and cross-functional collaboration to ensure robust package development and industrialization of new semiconductor products.
Role type
Senior Staff Engineer (Semiconductor Package Technology)
Builds
Advanced semiconductor package technologies for power systems and IoT applications
Domain
Semiconductor industry, Package Technology, Process Integration
Required skills
Semiconductor packaging technologies, Assembly processes, Process integration, Technology qualification, DFMEA, Risk assessment, Root cause analysis, Technical problem-solving, Cross-functional collaboration, Mentoring
Preferred skills
Experience in IC or semiconductor industry, Knowledge of package development methodologies, Ability to work across global teams
Technologies
Semiconductor packaging, Assembly processes, Process integration tools
Responsibilities
Drive Package Business Case and Technology Project Case assessments, Lead DFMEA activities, Own risk interaction assessments, Drive integration of unit processes and BOMs, Act as technical partner for Front-End and Back-End interaction, Support pre-development activities for next-generation technologies, Lead or participate in 8D investigations, Evaluate impact of package design rules, Provide technical guidance and mentoring, Collaborate with global cross-functional teams
Seniority
Senior Staff, hands-on IC with strategic oversight