Principal Engineer Package Concept Engineering (f/m/div)
Core
Developing and refining innovative package concepts for powering AI computing, focusing on modules and assembly technologies.
Role type
Principal Engineer, Package Concept Engineering
Builds
New packaging concepts, assembly concepts, and early-stage development projects for AI computing modules
Domain
Semiconductor packaging / AI computing hardware
Required skills
Package technology, Assembly technologies, Backend processes, Materials science, SMT-related technologies, Design tools (AutoCAD, Cadence), Simulation, Hardware demonstrators
Preferred skills
Knowledge of OSAT processes, Market trend analysis, Business strategy development
Technologies
AutoCAD, Cadence, Simulation tools, Hardware demonstrators
Responsibilities
Develop and refine innovative package concepts for powering AI computing modules; Validate concepts using simulations and hardware demonstrators; Develop new ideas and assembly concepts; Support development projects through to market launch; Identify and integrate technological trends into the packaging roadmap; Advise customers on packaging-specific issues
Seniority
Principal, hands-on IC with strategy & mentorship
