Lead Principal Engineer Package Technology
Core
Define and develop future semiconductor package technologies, leading innovation from concept feasibility through industrialization for new products.
Role type
Principal, strategy-level IC packaging engineer
Builds
Advanced semiconductor packaging solutions for power systems and IoT
Domain
Semiconductor manufacturing / IC packaging
Required skills
Semiconductor packaging expertise, SMT and assembly processes, Failure analysis, Reliability engineering, Technology roadmap development, Cross-functional team leadership, Feasibility studies, IP strategy, Technical benchmarking
Preferred skills
AutoCAD and 3D drafting, Patent generation, Mentoring engineering talent
Technologies
AutoCAD, 3D drafting tools
Responsibilities
Drive innovation and development of advanced package technologies from concept to industrialization, Identify industry trends and emerging technologies, Facilitate innovation by coaching teams and balancing technical risks, Contribute to technology roadmaps and standards, Support IP strategy and patent generation, Make key technical decisions and lead implementation, Lead global cross-functional projects, Benchmark competitor technologies, Investigate new materials and concepts, Serve as technical authority and mentor engineers, Drive business impact through strategic initiatives
Seniority
Principal, strategy & mentorship
