Senior Staff Engineer Technology Integration
Core
Lead risk interaction assessment and mitigation for semiconductor packaging, driving integration of unit processes and supporting pre-development for new chip technologies.
Role type
Senior Staff Engineer Technology Integration (Semiconductor Packaging)
Builds
Semiconductor packaging solutions for power systems and IoT
Domain
Semiconductor industry, specifically packaging, assembly, and test processes
Required skills
Semiconductor packaging, assembly, and test processes knowledge; 8D problem-solving methodology; T6S methodology; internal package analysis; first-level reliability assessment; cross-functional collaboration
Preferred skills
Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics); experience in IC/semiconductor industry
Technologies
None explicitly listed beyond domain processes
Responsibilities
Own and lead Risk Interaction Assessment and Mitigation work packages; Drive integration of unit processes (BOM and Process) within the package platform; Serve as key technical partner for Front-End teams on FE/BE interaction; Support pre-development activities for new chip technologies; Act as a driver in 8D problem-solving activities; Provide technical guidance on process interaction and integration
Seniority
Senior Staff, hands-on IC