Staff Process Engineer, APTD Bonding
Core
Develop, optimize, and validate semiconductor bonding processes to improve yield, reliability, and cost-efficiency for next-generation memory and storage products.
Role type
Staff Process Engineer (Semiconductor Packaging)
Builds
Advanced packaging interconnects and memory/storage solutions for AI and data center applications
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
DOE, SPC, defect analysis, root-cause analysis, FMEA, 8D, SPC/FDC methodology, process formulation, equipment specification, supplier audit
Preferred skills
MS/PhD in Materials Science/Chemical/Electrical/Mechanical Engineering, project team leadership
Technologies
SPC, FDC, RMS, APC, DOE tools
Responsibilities
Develop new or modified process formulations and define equipment requirements; Diagnose and resolve assembly process-related problems; Coordinate process, equipment, and material evaluation/optimization; Validate new process baselines for product introduction; Support SPC/FDC/RMS/APC and site-to-site portability; Audit material suppliers for quality and risk management
Seniority
Staff, hands-on IC with strategic oversight
