New College Grad - Process Integration Engineer, APTD
Core
Developing advanced packaging approaches and linking technologies for next-generation semiconductor products.
Role type
New College Grad Process Integration Engineer (Advanced Packaging)
Builds
Next-generation semiconductor products with advanced packaging and interconnect solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models
Required skills
Semiconductor process integration, Materials engineering, Device physics, Data analysis, Experimental design, Problem-solving
Preferred skills
Wafer-level packaging, Fan-out packaging, 2.5D/3D integration, Wirebond, Microbump, Hybrid bonding, Statistical methods, Design of Experiments (DoE)
Technologies
AI-enabled tools, Data-driven analysis tools
Responsibilities
Support development, characterization, and integration of packaging solutions; Collaborate with multi-functional teams to analyze process data; Participate in experiments, process evaluations, and technology qualification activities; Utilize AI-enabled tools to analyze engineering results; Promote safety, quality, and compliance culture
Seniority
Entry-level, New College Grad