Senior Engineer UPD Laser Marking and Singulation
Core
Primary technical expert in package singulation technology, driving development of next-generation semiconductor packaging solutions that are high-performing, cost-effective, and scalable for manufacturing.
Role type
Senior IC process development engineer (semiconductor packaging)
Builds
Next-generation semiconductor packaging solutions (tape-based, tapeless, laser marking, hybrid singulation)
Domain
Semiconductor manufacturing / Backend assembly
Required skills
Process development, Tape-based singulation, Tapeless singulation, Laser marking, Process optimization, FMEA documentation, Supplier liaison, Technology readiness evaluation, Process capability improvement, Technical guidance
Preferred skills
Strategic thinking, Stakeholder influence, Industry benchmarking
Technologies
Laser marking systems, Singulation equipment, FMEA tools, Process documentation systems
Responsibilities
Perform process development activities (scouting, optimization, verification, freeze), Drive qualification and implementation of singulation processes, Support prototype and development samples build, Liaise with suppliers for verification and qualification, Identify and develop new process technology, Provide technical guidance to other engineers
Seniority
Senior, hands-on IC