VIE -Taiwan- Package development F/H
Core
Support the introduction of new STM32 products through the development, qualification, and industrialization of assembly and packaging solutions.
Role type
Packaging development engineer
Builds
Assembly and packaging solutions for STM32 microcontrollers
Domain
Semiconductor manufacturing and packaging
Required skills
Materials science, mechanical engineering, microelectronics, electronics, semiconductor packaging technologies, industrialization, analytical mindset, problem-solving, technical documentation, process and material change management, cost optimization, supply chain management
Preferred skills
Cross-functional collaboration, autonomous work, international environment experience
Technologies
STM32, semiconductor packaging, assembly processes