VIE - SINGAPOUR - Ingénieur Procédés et Industrialisation en Packaging Microélectronique H/F
Core
Develop cutting methods for WLCSP packages to reduce cutting paths and costs, acting as the key liaison between ST and industrial subcontractors.
Role type
Process and Industrialization Engineer (Microelectronics Packaging)
Builds
WLCSP package cutting solutions and development methods
Domain
Semiconductor manufacturing / Microelectronics packaging
Required skills
Material physics knowledge, Semiconductor domain knowledge, Process development, Subcontractor management, Quality assurance, Cross-cultural collaboration
Preferred skills
Advanced semiconductor knowledge, Adaptability, Autonomy
Technologies
WLCSP, Cutting processes, Material physics
Responsibilities
Coordinate cutting development activities with local R&D team, Support development trials at subcontractors, Ensure quality and performance of processes with partners
Seniority
Mid-level, hands-on IC