Technical NPI Engineer
Core
Primary interface between ST Divisions and OSAT subcontractors to ensure timely response on technical events, drive assembly and yield improvement, and support production ramp-up for new products.
Role type
Technical NPI Engineer (Semiconductor Packaging)
Builds
New product packages (WLCSP) and assembly processes for semiconductor chips
Domain
Semiconductor industry, packaging and assembly (OSAT)
Required skills
WLCSP product knowledge, Bumping and DPS methodologies, WLCS process flow, problem solving, technical KPI management, PCN and QUAL pass management, LG BKMU+ deployment
Preferred skills
None stated
Technologies
WLCSP, Bumping, DPS, LG BKMU+
Responsibilities
Interface between ST Divisions and OSAT subcontractors, drive assembly and yield improvement to meet KPIs, support customer on-site audits and technical resolution, train subcontractors on ST technical requirements, manage key customer projects and DRI for CAT1 projects
Seniority
Mid-level, hands-on IC