Senior Wets Process Development Engineer (R&D)
Core
Technical anchor for end-to-end wet process portfolio, designing and optimizing plating, etching, and cleaning modules for semiconductor manufacturing.
Role type
Senior IC process development engineer (semiconductor wet processes)
Builds
Advanced plating processes (NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules for HVM readiness
Domain
Semiconductor manufacturing / Chemical engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electroless and Electrolytic plating, Wet Etching, Wafer Cleaning, Resist Stripping, Design of Experiments (DOE), Statistical Process Control (SPC), Material characterization analysis
Preferred skills
NiPdAu chemistry and stabilizer management, Surface preparation for FEOL applications
Technologies
SEM/EDX, AFM, SC1/SC2, SPM
Responsibilities
Lead design and optimization of advanced plating processes, Tackle complex localized process defects using analytical tools, Drive transition of new wet processes to high-volume manufacturing, Evaluate and integrate next-generation chemistries, Design and execute multi-variate experiments, Collaborate with Lithography, PVD, CVD, R&D, and Assembly teams
Seniority
Senior, hands-on IC
