LFAB Cu Plating Process Engineer
Core
Lead the ramp of 28nm analog and embedded wafer manufacturing activities, specifically focusing on Cu plating process development and sustenance.
Role type
Manufacturing Process Engineer (Cu Plating)
Builds
300mm analog and embedded processing chips for power electronics
Domain
Semiconductor manufacturing (300mm wafer fab, 28nm CMOS Planar technology)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical process control, Engineering change control, Process release strategies, Electroplating/Plating expertise, Lot disposition, Equipment disposition, Process experiments execution, Data analysis, Problem resolution
Preferred skills
Cu Plating and Cu Barrier Seed experience, BEOL process integration, Analytical problem solving, Fast-paced environment adaptation, Project initiative, Cross-functional collaboration, Time management
Technologies
300mm wafer fab equipment, 28nm CMOS Planar technology, SWRs (Start-up Wafer Runs)
Responsibilities
Support manufacturing operations and manufacturing ramp, Perform lot and equipment dispositions to minimize cycle time, Execute equipment/process startup and process experiments, Develop and implement improved manufacturing methods and procedures, Identify systematic problems in process or equipment sources, Participate in data analysis and problem resolution
Seniority
Mid-level, hands-on IC