CMP Module Engineer
Core
Optimizing Chemical Mechanical Polishing (CMP) processes in a 300mm high-volume manufacturing environment to ensure process stability, yield improvement, and defect reduction.
Role type
Senior IC CMP Module Engineer
Builds
Semiconductor wafers for high-volume manufacturing
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP process fundamentals (slurry, pad, conditioning), Defect mechanism analysis, Statistical Process Control (SPC), Data analysis, Process sustainment, Yield improvement strategies, Equipment troubleshooting, Documentation of process specs and control plans
Preferred skills
Experience with Applied Materials Reflexion LK CMP and Ebara F-REX-300 tools, Cross-functional project leadership
Technologies
Applied Materials Reflexion LK CMP, Ebara F-REX-300, SPC tools
Responsibilities
Monitor key CMP parameters (Removal rate, WIWNU, Defectivity), Analyze yield loss and defect trends to identify root causes, Execute continuous improvement projects for cost and performance optimization, Maintain process specifications and control plans, Interface with manufacturing and NPI teams for process transfers
Seniority
Senior, hands-on IC