Wet Process Development Engineer
Core
Develop, integrate, and qualify wet etch and clean chemistries for 28nm SiGe and silicided contact integration to enable technology ramp from development to high-volume manufacturing.
Role type
Wet Process Development Engineer (Semiconductor Manufacturing)
Builds
Wet etch and clean modules for 28nm SiGe and silicidation device flows
Domain
Semiconductor manufacturing, advanced nodes (28nm), SiGe device physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
SiGe device physics, surface preparation, chemical reaction kinetics, wet etch chemistries, DOE methodology, root cause analysis (FMEA/8D), Statistical Process Control (SPC), metrology (SEM/TEM/ellipsometry/AFM), single-wafer or batch wet process tool operation
Preferred skills
New wet process module development from ground up, inline-to-end-of-line signal correlation, rapid system ramp-up
Technologies
LAM, TEL, SCREEN, SEM, TEM, ellipsometry, AFM
Responsibilities
Develop and optimize wet process flows for SiGe epi-layer cleaning and selective removal; Define chemistries for high-precision isotropic and anisotropic etching with focus on selectivity and undercut control; Identify root causes of process-related defects and implement SPC; Partner with Epi, Lithography, Spacer Films, and CMP teams to ensure seamless integration; Utilize metrology tools to characterize surface roughness and etch profiles at atomic resolution
Seniority
Senior, hands-on IC