Assembly Design Kit (ADK) Engineer
Core
Lead the development of robust design rules and verification flows for next-generation 2.5D/3D Interposer and Heterogeneous Integration technologies.
Role type
Senior IC ADK Engineer (Advanced Packaging)
Builds
Assembly Design Kits (ADK) for 2.5D/3D IC, SiP, and Fan-Out technologies
Domain
Semiconductor Advanced Packaging
Required skills
Physical Verification (PV), Design Rule Check (DRC), Layout vs. Schematic (LVS), TSV, Micro-bump, bridge die, RDL, GDSII/OASIS data formats, EDA tool integration
Preferred skills
Tcl, Perl, Python, SKILL scripting, manufacturing process knowledge (Reflow, Molding, Bonding, FEOL/BEOL), design flow strategy
Technologies
Synopsys (IC Validator, 3DICC), Cadence (PVS, Virtuoso, Integrity 3D-IC), Siemens EDA (Calibre)
Responsibilities
Lead creation and maintenance of comprehensive Assembly Design Kits (ADK) for advanced packaging; Define, debug, and validate Design Rules (DRC) and LVS checks; Partner with package design, process integration, and manufacturing teams; Provide expert support for physical verification issues; Develop and automate verification flows using advanced scripting; Analyze and optimize the end-to-end package design flow
Seniority
Senior, hands-on IC
