Sr. Staff Thermo-Mechanical Engineer
Core
Lead thermo-mechanical simulation and characterization for advanced photonics packaging to enable AI architectures and meet power, optical, and reliability requirements.
Role type
Sr. Staff IC thermo-mechanical engineer (packaging)
Builds
3D-stacked photonics engines (Passage™) for extreme-scale AI and HPC data centers
Domain
Semiconductor packaging / Photonics / AI Infrastructure
Deliverable
production ML models | product features
Required skills
Finite element analysis (FEA), multi-physics simulation, thermal-structural coupling, solder joint fatigue modeling, warpage analysis, semiconductor packaging failure modes, wafer-level and unit-level assembly processes, Python/MATLAB automation, analytical modeling, characterization and validation
Preferred skills
Photonic packaging technologies (silicon photonics, co-packaged optics), optical packaging reliability, statistical analysis (DOE, JMP), technical writing, cross-functional communication
Technologies
Ansys, Abaqus, Python, MATLAB, JMP
Responsibilities
Serve as technical authority for thermo-mechanical simulation standards; identify capability gaps in simulation tooling; develop FEA models for stress, warpage, and assembly processes; perform reliability risk analysis; conduct multi-physics simulations including solder collapse and thermal-structural analysis; develop analytical models for quick assessments; drive characterization and validation through prototyping; automate workflows with Python/MATLAB; communicate findings to stakeholders and document methodologies
Seniority
Sr. Staff, hands-on IC with strategic influence
