HBM EQUIPMENT ENGINEER
Core
Optimize semiconductor assembly manufacturing processes, equipment, and materials for HBM production.
Role type
Manufacturing Equipment Engineer
Builds
High-bandwidth memory (HBM) memory and storage products
Domain
Semiconductor manufacturing / Hardware engineering
Required skills
Semiconductor equipment operation, Wafer level molding/dicing/thinning/mount/debond, DOE/FMEA/OCAP/8D/SPC, Equipment design and upgrade, Vendor coordination, Technical research, AI application for performance analysis (via careerplan.io/jobs/44769530-hbm-equipment-engineer-at-micron)
Preferred skills
FDC/Tool alarm analysis, Tool signal understanding (SVID, CEID, ECID), Tool installation/setup/buyoff procedures
Technologies
Semiconductor manufacturing tools, AI tools for analysis