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HBM EQUIPMENT ENGINEER

Taichung City, Taichung City, Taiwan💼 Full-time🗓 2026-10-05 → 2026-10-07

Core

Evaluate and improve HBM assembly manufacturing processes, equipment, and materials to optimize performance and yield.

Role type

Manufacturing Equipment Engineer (HBM) (via careerplan.io/jobs/44768599-hbm-equipment-engineer-at-micron)

Builds

High Bandwidth Memory (HBM) memory and storage products

Domain

Semiconductor manufacturing / Memory technology

Required skills

Thin film dicing, laser groove, NCF lamination, tool installation and setup, FDC analysis, DOE/FMEA/OCAP/8D/SPC, equipment design, supplier management

Preferred skills

Signal understanding (SVID, CEID, ECID), AI-enabled tools adoption, cost-saving material evaluation

Technologies

SVID, CEID, ECID, FDC, DOE, FMEA, OCAP, 8D, SPC

Responsibilities

Optimize process and equipment variables, identify process variables, perform containment of deviations, determine root cause, implement corrective actions, design equipment components, evaluate future technologies, build supplier relationships, create decision matrices for equipment selection

Seniority

Mid-level, hands-on IC