Packaging SIPI Engineer, Sr. Staff
Core
Lead signal integrity and power integrity analysis for automotive package design, optimizing package and IC designs to meet system-level constraints before tape-out.
Role type
Sr. Staff IC packaging engineer (signal/power integrity)
Builds
Automotive chip packages and system-level interfaces
Domain
Semiconductors / Automotive / Electrical Engineering
Required skills
System/Package Design, Time domain analysis, Frequency domain analysis, System simulation, Design guidelines development, Process automation, Technical documentation
Preferred skills
Automotive package design, AI for efficiency, SerDes specifications (PCIe, USB, UFS), Matlab automation, C/C++ or scripting (Perl/Python), Electromagnetics, Transmission line theory, Crosstalk analysis, Field solvers (HFSS, Q3D, Sentinel-PSI, Clarity), Simulation tools (ADS, Hspice), Layout tools (Cadence Allegro, Mentor Xpedition)
Responsibilities
Perform package extraction for time and frequency domain analysis, Conduct system-level analysis for DDR, SerDes, and mixed-signal interfaces, Provide design guidelines for package design, Perform system simulation and provide feedback for design optimization, Develop and automate design and analysis flows, Create technical documentation and presentations
Seniority
Sr. Staff, hands-on IC with leadership
