Packaging Technology Integration, Senior Staff Engineer
Core
Senior technical lead owning end-to-end packaging technology and product integration for RF Front End Modules in Cellular and Wireless Data markets, spanning wafer pre-assembly, chip-to-package co-design, NPI, and HVM.
Role type
Senior Staff Engineer, Semiconductor Packaging Integration
Builds
RF SiP applications, RF Front End Modules
Domain
Semiconductor / RF / Wireless Data
Required skills
Wafer pre-assembly (wafer BE), Cu pillar bumping, stealth dicing, plasma dicing, die sort, substrate and assembly solutions, OSAT technology transfer, SPC, FMEA, DOE, failure analysis, reliability testing, value engineering, 2.5D packaging evaluation
Preferred skills
PhD in Engineering, experience with tier-1 foundries, international travel
Technologies
Si, GaAs, Cu pillar, RDL, stealth dicing, plasma dicing, 2.5D packaging
Responsibilities
Drive development and integration of Si and GaAs packaging processes; Lead and qualify wafer singulation technologies; Drive substrate and assembly solutions for RF SiP applications; Own end-to-end technology integration into products; Develop and maintain packaging design rules; Serve as technical interface to OSATs; Drive SPC, FMEA, PCN, change control, audits, and benchmarking; Own yield, quality, throughput, and reliability improvements; Plan and execute DOE to optimize performance; Lead failure analysis and root cause resolution; Support customer NPQ, RMA analysis, and technical communication; Contribute to value engineering and cost reduction; Explore and evaluate future 2.5D packaging technologies
Seniority
Senior Staff, hands-on IC