Engineer, Process Integration PDE (Package Development Engineering)
Core
Drive process integration excellence for High Bandwidth (HBM) products during New Product Introduction (NPI), ensuring robust process readiness and yield ramp across Post Wafer Finishing, assembly, and test.
Role type
IC process integration engineer (NPI)
Builds
HBM memory and storage products
Domain
Semiconductor manufacturing (HBM technology)
Required skills
Semiconductor process flows, process integration concepts, yield/defect/variability analysis, Design of Experiments (DOEs), root cause analysis, data analysis (Excel, JMP, Python), NPI procedures, cross-functional collaboration
Preferred skills
Semiconductor industry internship, Micron industry knowledge, leadership track record, AI tool literacy
Technologies
JMP, Python, Excel
Responsibilities
Execute HBM NPI PI tasks and phase-gate requirements, support NPI builds via lot tracking and data collection, assist with NPI-to-HVM handoff, perform process characterization and window studies, support RCA and corrective actions, prepare technical documentation and trackers, integrate AI-assisted tools for efficiency and quality improvement
Seniority
Junior to Mid-level, hands-on IC (via careerplan.io/jobs/44532081-engineer-process-integration-pde-package-development-engineering-at-micron)