Engineer, Yield Enhancement PDE (Package Development Engineering)
Core
Monitor, manage, and stabilize yield for High Bandwidth Memory (HBM) New Product Introduction (NPI) builds from first silicon through early High Volume Manufacturing (HVM), acting as a hands-on yield owner.
Role type
Junior IC yield enhancement engineer (semiconductor manufacturing)
Builds
HBM NPI builds across Post Wafer Finishing, Assembly, and Test
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models
Required skills
Yield analysis, Physical Failure Analysis (PFA), Statistical Process Control (SPC), Fault Detection & Classification (FDC), data breakdown, defect analysis, AI tool integration
Preferred skills
Semiconductor industry internship, Auto-diagnostics software, leadership, Micron domain knowledge
Technologies
Auto-diagnostics, SPC, FDC, Yield Loss Ratio (YLR) dashboard
Responsibilities
Account for yield loss via defect breakdown and PFA submission; analyze yield deviation issues and trigger actions; support block run and partial conversion build yield analysis; maintain yield dashboards and trackers; brainstorm continuous improvement plans with Process Integration teams.
Seniority
Junior, entry-level IC