MTB ASSEMBLY HBM PROCESS ENGINEER
Core
Identify, diagnose, and resolve assembly process problems for memory and storage solutions while leading yield improvement and cost reduction initiatives.
Role type
Senior IC process engineer (assembly)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (memory and storage)
Deliverable
production ML models
Required skills
Process optimization, SPC/FDC/RMS/APC support, supplier management, audit management, new product introduction validation, site-to-site portability, AI tool integration
Preferred skills
AI-enabled enhancements, digital fluency, AI literacy
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization; Lead continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC; Manage and audit material suppliers; Support internal and external audits
Seniority
Senior, hands-on IC