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Metals/Films Process Development Engineer

Boise, Idaho, United States of AmericaFull-time2026-07-14 → 2026-10-16

Core

Develop, optimize, and sustain semiconductor manufacturing processes (thin film deposition, materials science) to improve product quality, yield, and cost.

Role type

Senior IC process development engineer (semiconductor manufacturing)

Builds

Scalable, reliable next-generation memory and storage devices

Domain

Semiconductor manufacturing / Materials science

Required skills

Thin film deposition (ALD, CVD, PVD), Surface analysis (XPS, AFM, XRD, AES, EBSD, SIMS), Solid-state physics, Materials science, Process troubleshooting (FA, FMEA, 8D, SPC/FDC), Supplier quality management

Preferred skills

Chemical kinetics, Statistical data analysis, Experimental design, Technical project leadership, AI-assisted analytics

Technologies

ALD, CVD, PVD, XPS, AFM, XRD, AES, EBSD, SIMS

Responsibilities

Diagnose and resolve assembly process issues using FA, FMEA, 8D, and SPC/FDC methodologies; Execute process, equipment, and material evaluations; Lead yield improvement and cost reduction initiatives; Qualify and scale new processes, tools, and materials for production; Manage supplier quality, audits, and risk mitigation activities

Seniority

Senior, hands-on IC