SENIOR ENGINEER FRONT END(FE) CENTRAL PROCESS INTEGRATION ENGINEERING (CPIE) PI
Core
Drive silicon node packaging product yield, quality improvement, and new product introduction (NPI) by integrating Front End manufacturing processes and leveraging AI-enabled engineering approaches.
Role type
Senior IC Process Integration Engineer (Packaging/Front End)
Builds
Semiconductor packaging solutions and DRAM memory products
Domain
Semiconductor manufacturing / DRAM / Advanced Packaging
Required skills
Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test, probe yield, BEOL integration, advanced packaging, layout, data analysis, troubleshooting, problem solving, project management, business process re-engineering, AI-enabled engineering approaches, advanced analytics, digital tools
Preferred skills
Strategic thinking, systematic approach, cross-functional collaboration, presentation skills, organizational capabilities, initiative
Technologies
Microsoft Office, Microsoft Copilot, digital collaboration platforms, AI-powered tools, data analytics, automation solutions, intelligent workflows
Responsibilities
Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution; Define strategies to ensure Packaging Technology and Front End manufacturing process interaction are fully developed and qualified; Lead the PI Loop taskforce to address yield and quality challenges and optimize process flow; Maintain and enhance domain knowledge and technical expertise; Maintain strong relationships with peers in Fab, TD, Product Engineering, and GQ; Drive AI and digital transformation initiatives to improve engineering efficiency and decision-making
Seniority
Senior, hands-on IC