Engineer, HIG HBM LAYOUT
Core
Design and development of critical analog, mixed-signal, custom digital blocks, and full chip level integration for High Bandwidth Memory (HBM) solutions.
Role type
Senior IC layout engineer (analog/mixed-signal)
Builds
Production-ready custom analog and mixed-signal blocks for HBM chips
Domain
Semiconductor / Memory / VLSI (via careerplan.io/jobs/43060687-engineer-hig-hbm-layout-at-micron)
Required skills
Analog layout design, Mixed-signal layout, Custom digital block layout, LVS/DRC verification, Cadence VLE/VXL, Mentor Calibre DRC/LVS, Temperature sensor design, PLL design, ADC/DAC design, LDO design, Bandgap reference design, Charge pump design, Current mirror design, Comparator design, Differential amplifier design, Electromigration analysis, Latch-up analysis, IR-drop analysis, Parasitic extraction, Tape-out support
Preferred skills
Multiple tape-out experience, Test vehicle build experience
Technologies
Cadence VLE, Cadence VXL, Mentor Calibre
Responsibilities
Design and develop critical analog, mixed-signal, custom digital blocks and full chip level integration; Perform layout verification (LVS/DRC/Antenna) and quality checks; Guide peer team members in sub-block-level layouts and review critical items; Estimate area and time for layout projects; Support test vehicle builds for HIG-HBM DTPCO teams.
Seniority
Mid-level, hands-on IC