New College Grad - Product Yield Enhancement Engineer, HBM
Core
Analyze failures from production test, qualification, and customer returns using electrical, physical, and data-driven techniques to identify root causes in HBM fabrication and assembly.
Role type
Junior IC product yield enhancement engineer (failure analysis)
Builds
Next-generation High Bandwidth Memory (HBM) products
Domain
Semiconductor manufacturing (HBM)
Deliverable
production ML models
Required skills
Electrical failure analysis, Physical failure analysis (PFA), Root cause analysis, Semiconductor device physics, VLSI design principles, UNIX/Linux scripting (Tcl, Bash, Shell), CAD (layout/schematic analysis), Data modeling
Preferred skills
Fault isolation techniques, Semiconductor packaging knowledge, Reliability engineering methodologies, AI-assisted analytics
Technologies
Emission microscopy, Laser-based methods, EOTPR, AI-assisted tools
Responsibilities
Perform electrical failure analysis and fault isolation; Analyze and model failure signatures from backend testing and RMA data; Apply physical failure analysis and de-processing techniques; Develop deep technical knowledge of CMOS/FinFET processes; Generate failure analysis reports; Collaborate with cross-functional teams; Apply AI-assisted tools to analyze large datasets
Seniority
Junior, entry-level IC