Principal Product Yield Analysis Engineer
Core
Resolve complex test yield and reliability issues for next-generation semiconductor devices (HBM, DRAM) from design to mass production using failure analysis and data analytics.
Role type
Principal Product Yield Analysis Engineer (IC)
Builds
Next-generation memory and storage solutions (HBM, DRAM) for mass production
Domain
Semiconductor manufacturing / Failure Analysis
Deliverable
production ML models | product features
Required skills
Electrical failure analysis, physical failure analysis, optical fault isolation, EDA tools, fab/backend data analysis, root cause analysis, cross-functional coordination
Preferred skills
3D-integration/packaging root cause analysis, sub-10nm process knowledge, ML/AI applied to failure analysis, advanced programming (Java, C++, Python, R)
Technologies
ESDA, layout/net tracing, advanced image analyzers, photon emission, optical probing, microprobing, hybrid/2.5D/3D EDA tools
Responsibilities
Perform electrical/physical failure analysis and optical fault isolation to determine root causes; Leverage EDA tools for circuit understanding and failure signature analysis; Dissect fab/probe data and correlate with reliability data; Lead cross-site teleconferences to present findings and recommend corrective actions; Mentor remote FA teams and develop new failure analysis techniques
Seniority
Principal, hands-on IC with mentorship