Principal Engineer Advanced Package Technology Development
Core
Lead the development of advanced semiconductor packaging technologies to enable high-performance memory and storage solutions.
Role type
Principal Engineer, Advanced Package Technology Development
Builds
High Bandwidth Memory, 2.5D/3D integration strategies, and hybrid bonding solutions for data centers and AI applications.
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Advanced packaging strategy, High Bandwidth Memory expertise, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, 3D stacking, DRAM manufacturing, OSAT operations, Competitive analysis, Technical roadmap planning, Patent generation, Cost reduction, Quality improvement
Preferred skills
DRAM wafer structure knowledge, East Asian languages, Published literature or patents
Technologies
Hybrid bonding, 2.5D integration, 3D stacking, Wafer Level Packaging, DRAM processes
Responsibilities
Guide the development of packaging technology roadmaps, Lead multi-disciplinary technical teams, Collaborate with internal and external partners, Consult on technical and strategic decisions, Troubleshoot advanced packaging issues, Innovate through patents and technical presentations, Analyze competitive trends, Define technical requirements
Seniority
Principal, hands-on IC with strategic influence