CareerPlan

DRAM Process Integration Engineer

Boise, Idaho, United States of AmericaFull-time2026-06-26 → 2026-10-20

Core

Define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices.

Role type

Senior IC process integration engineer (semiconductor R&D)

Builds

Advanced DRAM devices and memory solutions

Domain

Semiconductor manufacturing / Memory technology

Required skills

Semiconductor device physics, materials science, process integration, design of experiments (DOE), statistical data analysis, project leadership

Preferred skills

Cleanroom processing, advanced semiconductor manufacturing, characterization techniques, defect reduction, AI-assisted analytics

Technologies

R&D fab equipment, inline parametric testing tools, probe stations

Responsibilities

Lead integration activities for advanced semiconductor devices (charge storage, TFTs), evaluate device operating mechanisms and failure modes, partner with cross-functional teams to resolve yield and reliability challenges, design and analyze experiments to optimize process flows, analyze data to drive yield improvement and cost reduction

Seniority

Senior, hands-on IC