Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory
Core
Developing, validating, and qualifying next-generation High Bandwidth Memory (HBM) products to ensure reliability, optimize manufacturing test flows, and improve yield for DRAM, interface, and stacked die architectures.
Role type
Senior IC Product & System Engineering (HBM Manufacturing)
Builds
Next-generation HBM products (DRAM, Interface, Stacked) for data center and AI applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM architecture
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMOS technology, DRAM architecture, device physics, circuit debug, test coverage optimization, DFT strategy, root cause analysis, project management, cross-functional collaboration
Preferred skills
Semiconductor device coursework, Python scripting, JMP, statistics, data analysis
Technologies
Verilog, CAD tools, Python, JMP
Responsibilities
Optimizing test coverage for current and future HBM design architectures; developing and validating next-generation HBM products; supporting new product design verification using CAD tools and Verilog simulations; improving manufacturing test yields and reducing test time; resolving root causes of manufacturing test flow, qualification, and RMA device issues; promoting innovation to drive technical advantage; making technical decisions on risk analysis and project prioritization; collaborating with cross-functional teams (Fab, Design, Test, Quality).
Seniority
Senior, hands-on IC