Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing)
Core
Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, focusing on quality, cost, cycle time, and scale optimization.
Role type
Senior IC semiconductor product and system engineering
Builds
High Bandwidth Memory (HBM) DRAM die, interface die, and stacked HBM solutions
Domain
Semiconductor manufacturing and memory technology
Required skills
HBM product enablement, manufacturing test flow development, device and stack-level yield improvement, circuit debug, test coverage optimization, Design-For-Test (DFT) strategy, root cause analysis, project management, technical decision making
Preferred skills
Semiconductor device experience, circuit design, product validation, CMOS technology, DRAM architecture, device physics, data analysis, statistics, Python, JMP
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Ensure optimized test coverage for HIG HBM design architectures and process nodes; Develop, validate, characterize, and qualify next-generation HBM products; Support new product design verification using CAD tools and Verilog simulations; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Promote innovation to maintain competitive technical advantage; Mentor and develop team members; Make final decisions on risk analysis and project prioritization; Collaborate with cross-functional teams including Fab, Design Engineering, and Quality/Reliability.
Seniority
Senior, hands-on IC