Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Core
Drive Media Health manufacturing execution for next-generation High Bandwidth Memory (HBM) products, including DRAM die, interface die, and stacked HBM solutions.
Role type
Senior IC semiconductor product system engineer (HBM manufacturing)
Builds
Next-generation HBM products (DRAM, interface, stacked die) for data center and AI applications
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Required skills
CMOS technology, DRAM architecture, device physics, circuit design, root cause analysis, yield improvement, test flow development, DFT strategy, CAD tools, Verilog simulation, data analysis, Python scripting
Preferred skills
AI-powered tools and automation, project management, mentorship
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Ensure optimized test coverage on HBM design architectures; Develop, validate, and qualify next-generation HBM products; Support design verification and circuit analysis using CAD and Verilog; Improve manufacturing test yields and reduce test time; Resolve manufacturing test flow, qualification, and RMA device issues; Promote innovation for technical advantage; Mentor team members; Make technical decisions on risk analysis and project prioritization; Collaborate with cross-functional teams (Fab, Design, Technology, Quality).
Seniority
Senior, hands-on IC