PhD Student in Cyber-Physical Systems
Core
Develop additive manufacturing techniques for micro- and nanoscale metal interconnects in multilayer chiplet packaging devices using laser micromachining and selective metallisation.
Role type
PhD researcher in additive manufacturing and micro/nanofabrication
Builds
Next-generation semiconductor packaging materials, equipment, and processes for the E2PACKMAN European consortium
Domain
Semiconductor manufacturing, additive manufacturing, micro/nanofabrication, chiplet packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
experimental laboratory work in micro- or nanofabrication, materials processing, or electronics manufacturing, analytical and problem-solving skills, ability to work in interdisciplinary teams
Preferred skills
laser direct writing, electroless plating, photolithography, additive manufacturing, characterisation tools (XCT, SEM, AFM), CAD and simulation tools (CLEWIN, ANSYS, COMSOL), electronics packaging, HDI substrates, chiplet architectures, cleanroom experience
Technologies
femtosecond/picosecond lasers, selective metallisation, photosensitive materials, SEM, AFM, XCT, optical microscopy
Responsibilities
develop additive techniques for patterning micro- and nanoscale metal interconnects, identify and optimise polymers and photosensitive materials, establish laser micro-drilling and selective metallisation, characterise results for geometric accuracy and durability, validate scalability and sustainability
Seniority
PhD candidate, independent research with supervision
