Semiconductor Packaging Engineer / Process Engineer Advanced Packaging (m/f/d)
Core
Development and optimization of technologies and processes in Advanced Semiconductor Packaging, focusing on external customer projects and internal development initiatives.
Role type
Process Engineer (Advanced Packaging)
Builds
Custom component manufacturing solutions, System in Package, and Chiplet technologies
Domain
Semiconductor manufacturing, Advanced Packaging
Required skills
Process engineering, Quality management, Customer project management, Wafer processing, Molding, Chip on Board, Soldering, Substrate technologies
Preferred skills
Advanced Packaging, System in Package, Chiplet technologies
Technologies
Wafer processing, Molding, Chip on Board, Soldering, Substrate technologies
Responsibilities
Develop and industrialize technology processes, Manage external customer projects, Coordinate internal development projects, Collaborate with Process Engineering and Sales, Ensure quality standards and project goals
Seniority
Mid-level, hands-on IC