Principal Engineer, Thermo-Mechanical
Core
Lead development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms, defining architecture requirements and evaluating cooling solutions for AI, networking, and silicon photonics products.
Role type
Principal Engineer, Thermo-Mechanical (Advanced Packaging)
Builds
Advanced packaging technologies and package architectures for next-generation AI, cloud, networking, silicon photonics, and co-packaged optics products.
Domain
Semiconductor manufacturing / Advanced Packaging / Thermal Management
Required skills
Thermal and thermo-mechanical analysis, Heat transfer, Structural mechanics, Material behavior, Package reliability, Failure mechanisms, Simulation methodologies, Technology selection, Design tradeoff analysis, Mentorship
Preferred skills
AI accelerator development, Heterogeneous integration, Hybrid bonding, Advanced substrates, Technical publications/patents
Technologies
ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL
Responsibilities
Lead development of thermal and thermo-mechanical technologies, Define thermal architecture requirements, Develop and evaluate advanced cooling solutions, Perform thermal, structural, and thermo-mechanical analysis, Correlate simulation models with laboratory measurements, Investigate thermal and mechanical failure mechanisms, Mentor engineers and develop design practices
Seniority
Principal, hands-on IC with strategy & mentorship
